Revolutionizing Electronics Production with the REDOX-Tool

Introducing the REDOX-Tool from Plasmatreat, an innovative solution designed to meet the highest demands of modern electronics manufacturing.

As the industry moves towards miniaturization and higher performance, the challenges posed by oxidized and contaminated metal surfaces become more critical.

The REDOX-Tool offers a state-of-the-art inline oxide reduction process using Openair-Plasma® technology, setting a new standard for efficiency and quality in semiconductors and IGBT production.

The Importance of Surface Treatment and Oxide Reduction

Surface treatment, particularly oxide reduction, is crucial for the production of power electronics and semiconductors. These components are essential for a wide range of high-performance electronic applications, from consumer electronics to industrial machinery and automotive systems. Ensuring the purity and cleanliness of metal surfaces is vital for several reasons:

The REDOX-Tool - Flux less inline Oxide Reduction

  1. Improved Electrical Performance: Oxide layers on metal surfaces can impede electrical conductivity, leading to inefficient performance and increased resistance. Removing these layers ensures optimal electrical contact, which is critical for the high currents and voltages managed by IGBTs and semiconductors.

  2. Enhanced Adhesion: Oxidized surfaces can compromise the adhesion of subsequent layers or components. In semiconductor manufacturing, strong and reliable bonds are essential for the durability and performance of the final product. Effective oxide reduction promotes better adhesion, leading to more robust and reliable components.

  3. Reduced Defects and Failures: Oxides and contaminants can cause defects during the manufacturing process, such as voids or delamination, which can lead to failures in the field. By ensuring a clean surface, oxide reduction minimizes the risk of these defects, enhancing the reliability and lifespan of the components.

  4. Efficiency in Miniaturization: As electronic components become smaller, the margin for error decreases. Tiny imperfections caused by oxides can have significant impacts on performance and reliability. Surface treatment ensures that even the smallest components are manufactured to the highest standards, supporting ongoing trends in miniaturization.


Advanced Technology for Modern Challenges

The REDOX-Tool is specifically designed to address the technical challenges of miniaturization, reduced bump pitch, and issues with flux usage and residues.

By employing a combination of nitrogen and hydrogen in a tunnel concept, this tool achieves flux-free bonding and thorough cleaning and reduction of only the metal oxide layer. The original metal layer will not be affected, which distinguishes it from a sputtering process.

The process is divided into three zones: pre-heating, plasma reduction, and cooling, ensuring optimal conditions for each step.


for inline oxide reduction
amongst others

  • Semiconductors: Enhances joint quality, electrical and thermal conductivity, and overall reliability by eliminating oxide layers.
  • Power Modules: Ensures performance and reliability throughout the assembly process, from DCB substrate to die attach, wire bonding, sintering, and molding.

Key Benefits of the REDOX-Tool

  1. Enhanced Surface Quality: Effectively removes oxide layers and contaminants from metal surfaces, ensuring a pristine surface for improved adhesion and bonding.

  2. Improved Electrical Performance: Eliminates oxide layers to enhance electrical conductivity and reliability, crucial for high-performance components.

  3. Increased Process Efficiency: Allows continuous processing with batch handling through the vacuum, reducing downtime and increasing throughput while ensuring continuous process control for every part.

  4. Better Solderability: Clean, oxide-free surfaces improve solder wettability, leading to stronger and more reliable joints.

  5. Reduced Need for Flux: Minimizes flux use, reducing residue-related issues and simplifying cleaning requirements.

  6. Higher Yield Rates: Fewer defects and rework lead to higher yields and reduced waste.

  7. Cost Savings: Greater efficiency, higher yields, and reduced consumable use contribute to significant cost savings.

  8. Environmental Benefits: Lower chemical usage lessens environmental impact, aligning with green manufacturing practices.

  9. Scalability: Easily integrated into existing production lines for scalable implementation without significant disruption.